Peer Review History: Quasi-3D Thermal Modelling of Advanced Electronic Systems in Package


(1) Prof. Giovanni Bucci, University of L’Aquila, Italy.

Approved by:

(1) Dr. Chien-Jen Wang, National University of Tainan, Taiwan.


(1) Qian Lin, Qinghai Minzu University, China.

(2) Jalal Jahanpanah, Semanan University, Iran.

Additional Reviewers:

Additional Reviewers: (Comments received after deadline)

Peer Review History:

Peer review report_1 (Qian Lin, China) | File 1 | File 2

Peer review report_2 (Jalal Jahanpanah, Iran) | File 1 | NA

Comment_Academic_Editor | File 1 | NA

Comment_Book_Editor | File 1 | NA